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22-21UYC/S530-XX/TR8

Features: `Package in 8mm tape on 7diameter reel.`Compatible with automatic placement equipment.`Compatible with infrared and vapor phase reflow solder process.`Mono-color type.`Pb-free.`The product itself will remain within RoHS complaint Version.Application·Automotive: backlighting in dashboard ...

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SeekIC No. : 004215647 Detail

22-21UYC/S530-XX/TR8: Features: `Package in 8mm tape on 7diameter reel.`Compatible with automatic placement equipment.`Compatible with infrared and vapor phase reflow solder process.`Mono-color type.`Pb-free.`The product...

22-21UYC/S530-XX/TR8 Data Sheet

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Part Number:
22-21UYC/S530-XX/TR8
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/7

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Product Details

Description



Features:

`Package in 8mm tape on 7diameter reel.
`Compatible with automatic placement equipment.
`Compatible with infrared and vapor phase reflow solder process.
`Mono-color type.
`Pb-free.
`The product itself will remain within RoHS complaint Version.


Application

·Automotive: backlighting in dashboard and switch.
·Telecommunication: indicator and backlighting in telephone and fax.
·Flat backlight for LCD, switch and symbol.
·General use.
·Indoor signboard use.


Specifications

Reverse Voltage VR ........................................5 V
Forward Current IF 25 ....................................mA
Operating Temperature Topr........... -40 ~ +85
Storage Temperature Tstg ..............-40 ~ +90
Electrostatic Discharge(HBM) ESD ..............150 V
Power Dissipation Pd 110 .............................mW
Peak Forward Current (Duty 1/10 @1KHz) IFP...100 mA
Soldering Temperature Tsol.......Reflow Soldering : 260 for 10 sec.
....................................................Hand Soldering : 350 for 3 sec. 


Description

·The 22-21 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.

·Besides, lightweight makes them ideal for miniature applications. etc.




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