2021-200

Features: · Microstrip Technology· Fast rise time for high frequency applications· Delay available from 100ps to 2500ps· Very narrow device (SIP package)· Stackable for PC board economy· Epoxy encapsulated· Meets or exceeds MIL-D-23859CPinoutSpecifications· Tolerance: 2% or 10ps· Bandwidth: >35...

product image

2021-200 Picture
SeekIC No. : 004215031 Detail

2021-200: Features: · Microstrip Technology· Fast rise time for high frequency applications· Delay available from 100ps to 2500ps· Very narrow device (SIP package)· Stackable for PC board economy· Epoxy encap...

floor Price/Ceiling Price

Part Number:
2021-200
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

Rating

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Upload time: 2024/11/23

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Product Details

Description



Features:

· Microstrip Technology
· Fast rise time for high frequency applications
· Delay available from 100ps to 2500ps
· Very narrow device (SIP package)
· Stackable for PC board economy
· Epoxy encapsulated
· Meets or exceeds MIL-D-23859C



Pinout

  Connection Diagram


Specifications

· Tolerance: 2% or 10ps
· Bandwidth: >350MHz
· Ripple in pass-band: Approx. 0.2dB
· Dielectric breakdown: >500 Vdc
· Operating temperature: -65°C to +125°C
· Temperature coefficient: <100 PPM/°C



Description

The 2020- and 2021-series devices are fixed, single-input, single-output,passive delay lines. The signal input (IN) 2021-200 is reproduced at the output (OUT), shifted by a time (TD) given by the device dash number. The characteristic impedance of the lines is nominally 50 ohms. The rise time (TR) of the lines is no more than 1ns, resulting in a 3dB bandwidth of at least 350MHz.




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