Features: · For surface mounted applications in order to optimize board space· Low profile package· Built-in strain relief· Glass passivated junction· Low inductance· Typical ID less than 1A above 13V· High temperature soldering : 260/10 seconds at terminals· Plastic package has Underwriters Lab...
1SMC5368: Features: · For surface mounted applications in order to optimize board space· Low profile package· Built-in strain relief· Glass passivated junction· Low inductance· Typical ID less than 1A above ...
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SYMBOL |
VALUE |
UNITS | |
DC Power Dissipation @ TL=75, Measure at Zero Lead Length(Fig. 1) Derate above 75(Note 1) |
PD |
5.0 40.0 |
Watts mW/ |
Peak forward Surge Current 8.3ms single half sine-wave superimposed on rated load(JEDEC Method) (Note 1,2) |
IFSM |
See Fig. 5 |
Amps |
Operating Junction and Storage Temperature Range |
TJ,TSTG |
-55 to +150 |