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1SMB3EZ

Features: For surface mounted applications in order to optimize board spaceLow profile packageBuilt-in strain reliefGlass passivated junctionLow inductanceExcellent clamping capabilityTypical ID less than 1 £gA above 11VHigh temperature soldering :260 ¢J /10 seconds at terminalsPlastic ...

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SeekIC No. : 004214307 Detail

1SMB3EZ: Features: For surface mounted applications in order to optimize board spaceLow profile packageBuilt-in strain reliefGlass passivated junctionLow inductanceExcellent clamping capabilityTypical ID les...

1SMB3EZ Data Sheet

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Part Number:
1SMB3EZ
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/2/15

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Product Details

Description



Features:

For surface mounted applications in order to optimize board space
Low profile package
Built-in strain relief
Glass passivated junction
Low inductance
Excellent clamping capability
Typical ID less than 1 £gA above 11V
High temperature soldering :260 ¢J /10 seconds at terminals
Plastic package has Underwriters Laboratory Flammability Classification 94V-O


Specifications

SYMBOL VALUE UNITS
Peak Pulse Power Dissipation (Note A)
Derate above 75 ¢J		 PD

3
24

 Watts
mW/¢J
Peak forward Surge Current 8.3ms single half sine-wave superimposed on rated load(JEDEC Method) (Note B) IFSM 15 Amps
Operating Junction and Storage Temperature Range TJ,TSTG -55 to +150 ¢J



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