19-219/B6C-ZN1P2TY/3T

Features: Package in 8mm tape on 7diameter reel.Compatible with automatic placement equipment.Compatible with infrared and vapor phase reflow solder process.Pb-free.The product itself will remain within RoHS compliant version.The maximum height is 0.25mm.The component weight is approximately 0.68 ...

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SeekIC No. : 004212202 Detail

19-219/B6C-ZN1P2TY/3T: Features: Package in 8mm tape on 7diameter reel.Compatible with automatic placement equipment.Compatible with infrared and vapor phase reflow solder process.Pb-free.The product itself will remain wi...

floor Price/Ceiling Price

Part Number:
19-219/B6C-ZN1P2TY/3T
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/7/15

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Product Details

Description



Features:

Package in 8mm tape on 7diameter reel.
Compatible with automatic placement equipment.
Compatible with infrared and vapor phase reflow solder process.
Pb-free.
The product itself will remain within RoHS compliant version.
The maximum height is 0.25mm.
The component weight is approximately 0.68 mg



Application

Backlighting in dashboard and switch.
Telecommunication: indicator and backlighting in telephone and fax.
Flat backlight for LCD, switch and symbol.
General use.



Specifications

Parameter
Symbol
Rating
Unit
Reverse Voltage
VR
5
V
Forward Current
IF
10
mA
Peak Forward Current (Duty 1/10 @1KHz)
IFP
30
mA
Power Dissipation
Pd
40
mW
Electrostatic Discharge(HBM)
ESD
1000
V
Operating Temperature
Topr
-40 ~ +85
Storage Temperature
Tstg
-40 ~ +90
Soldering Temperature
Tsol
Reflow Soldering : 260 for 10 sec.
Hand Soldering : 350 for 3 sec.



Description

The 19-219/B6C-ZN1P2TY/3T SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
Besides, lightweight makes 19-219/B6C-ZN1P2TY/3T ideal for miniature applications. etc.




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