Features: Package in 8mm tape on 7diameter reel.Compatible with automatic placement equipment.Compatible with infrared and vapor phase reflow solder process.Pb-free.The product itself will remain within RoHS compliant version.The maximum height is 0.25mm.The component weight is approximately 0.68 ...
19-219/B6C-ZN1P2TY/3T: Features: Package in 8mm tape on 7diameter reel.Compatible with automatic placement equipment.Compatible with infrared and vapor phase reflow solder process.Pb-free.The product itself will remain wi...
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Features: `Package in 8mm tape on 7diameter reel.`Compatible with automatic placement equipment.`C...
Parameter |
Symbol |
Rating |
Unit |
Reverse Voltage |
VR |
5 |
V |
Forward Current |
IF |
10 |
mA |
Peak Forward Current (Duty 1/10 @1KHz) |
IFP |
30 |
mA |
Power Dissipation |
Pd |
40 |
mW |
Electrostatic Discharge(HBM) |
ESD |
1000 |
V |
Operating Temperature |
Topr |
-40 ~ +85 |
|
Storage Temperature |
Tstg |
-40 ~ +90 |
|
Soldering Temperature |
Tsol |
Reflow Soldering : 260 for 10 sec. Hand Soldering : 350 for 3 sec. |
The 19-219/B6C-ZN1P2TY/3T SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
Besides, lightweight makes 19-219/B6C-ZN1P2TY/3T ideal for miniature applications. etc.