19-217/W1D-DP1Q2QY/3T

Features: Package in 8mm tape on 7diameter reel.Compatible with automatic placement equipment.Compatible with infrared and vapor phase reflow solder process.Mono-color type.Pb-free.The product itself will remain within RoHS compliant version.ApplicationAutomotive: backlighting in dashboard and swi...

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SeekIC No. : 004212182 Detail

19-217/W1D-DP1Q2QY/3T: Features: Package in 8mm tape on 7diameter reel.Compatible with automatic placement equipment.Compatible with infrared and vapor phase reflow solder process.Mono-color type.Pb-free.The product itsel...

floor Price/Ceiling Price

Part Number:
19-217/W1D-DP1Q2QY/3T
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/12/25

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Product Details

Description



Features:

Package in 8mm tape on 7diameter reel.
Compatible with automatic placement equipment.
Compatible with infrared and vapor phase reflow solder process.
Mono-color type.
Pb-free.
The product itself will remain within RoHS compliant version.



Application

Automotive: backlighting in dashboard and switch.
Telecommunication: indicator and backlighting in telephone and fax.
Flat backlight for LCD, switch and symbol.
General use.



Specifications

Parameter
Symbol
Rating
Unit
Reverse Voltage
VR
5
V
Forward Current
IF
25
mA
Operating Temperature
Topr
-40~ +85
Storage Temperature
Tstg
-40~ +90
Soldering Temperature
Tsol
260 (for10seconds)
Electrostatic
Discharge(HBM)
ESD
150
V
Power Dissipation
Pd
110
mW
Peak Forward Current
(Duty 1/10 @1KHz)
IFP
100
mA
Soldering Temperature
Tsol
Reflow Soldering : 260 for 10 sec.
Hand Soldering : 350 for 3 sec.



Description

The 19-217/W1D-DP1Q2QY/3T SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
Besides, lightweight makes 19-217/W1D-DP1Q2QY/3T ideal for miniature applications. etc.




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