19-213/Y2C-FN1P1VZ/DT

Features: `Package in 8mm tape on 7diameter reel.`Compatible with automatic placement equipment.`Compatible with infrared and vapor phase reflow solder process.`Mono-color type.`Pb-free.`The product itself will remain within RoHS compliant version.Application·Backlighting in dashboard and switch.·...

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19-213/Y2C-FN1P1VZ/DT Picture
SeekIC No. : 004212162 Detail

19-213/Y2C-FN1P1VZ/DT: Features: `Package in 8mm tape on 7diameter reel.`Compatible with automatic placement equipment.`Compatible with infrared and vapor phase reflow solder process.`Mono-color type.`Pb-free.`The product...

floor Price/Ceiling Price

Part Number:
19-213/Y2C-FN1P1VZ/DT
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/11/23

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Product Details

Description



Features:

`Package in 8mm tape on 7diameter reel.
`Compatible with automatic placement equipment.
`Compatible with infrared and vapor phase reflow solder process.
`Mono-color type.
`Pb-free.
`The product itself will remain within RoHS compliant version.



Application

·Backlighting in dashboard and switch.
·Telecommunication: indicator and backlighting in telephone and fax.
·Flat backlight for LCD, switch and symbol.
·General use.



Specifications

Reverse Voltage VR .................................................5 V
Forward Current IF .............................................25 mA
Peak Forward Current (Duty 1/10 @1KHz) IFP....60 mA
Power Dissipation Pd ........................................60 mW
Electrostatic Discharge(HBM) ESD ....................2000 V
Operating Temperature Topr................... -40 ~ +85
Storage Temperature Tstg ......................-40 ~ +90
Soldering Temperature Tsol
............................Reflow Soldering : 260 for 10 sec
................................Hand Soldering : 350 for 3 sec.



Description

·The 19-213/Y2C-FN1P1VZ/DT SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.

·Besides, lightweight makes 19-213/Y2C-FN1P1VZ/DT ideal for miniature applications. etc.




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