19-213 Selling Leads, Price trend, 19-213 DataSheet download, circuit diagram from SeekIC.com

Features: `Package in 8mm tape on 13diameter reel.`Compatible with automatic placement equipment.`Compatible with infrared and vapor phase reflow solder process.`Mono-color type.`Pb-free.`The product itself will remain within RoHS complaint version.Application·Automotive: backlighting in dashboard...

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SeekIC No. : 004212161 Detail

19-213: Features: `Package in 8mm tape on 13diameter reel.`Compatible with automatic placement equipment.`Compatible with infrared and vapor phase reflow solder process.`Mono-color type.`Pb-free.`The produc...

19-213 Data Sheet

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Part Number:: 19-213
Supply Ability:: 5000

Price Break

Qty
1~5000

Unit Price
Negotiable

Processing time
15 Days

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Month Sales

268 Transactions

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Upload time: 2024/11/23

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Recent History
What is this?

19-21/B6C-AP2Q2M/3T evaluate
US $.06 - .13 / Piece

Standard LED - SMD Blue
19-21/BHC-AN1P2/3T evaluate
Features: `Package in 8mm tape on 7diameter reel.`Compatible with automatic placement equipment.`C...
19-21/BHC-AP1Q2/3T evaluate
US $.08 - .17 / Piece

Standard LED - SMD SMD LED

Product Details

Description

Features:

`Package in 8mm tape on 13diameter reel.
`Compatible with automatic placement equipment.
`Compatible with infrared and vapor phase reflow solder process.
`Mono-color type.
`Pb-free.
`The product itself will remain within RoHS complaint version.

Application

·Automotive: backlighting in dashboard and switch.
·Telecommunication: indicator and backlighting in telephone and fax.
·Flat backlight for LCD, switch and symbol.
·General use.

Specifications

Parameter	Symbol	Rating	Unit
Reverse Voltage	V_R	5	V
Forward Current	I_F	25	mA
Operating Temperature	T_opr	-40 ~ +85
Storage Temperature	T_stg	-40 ~ +90
Power Dissipation	P_d	110	mW
Electrostatic Discharge	ESD	150	V
Peak Forward Current (Duty 1/10 @1KHz)	I_F	100	mA
Soldering Temperature	T_sol	Reflow Soldering : 260 for 10sec. Hand Soldering : 350 for 3 sec.

Description

·The 19-213 SMD Taping is much smaller than lead frame type components, thus enable smaller board size,
higher packing density, reduced storage space and finally smaller equipment to be obtained.
·Besides, lightweight makes 19-213 ideal for miniature applications. etc.

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19-213

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