Features: Package in 8mm tape on 7diameter reel.Compatible with automatic placement equipment.Compatible with infrared and vapor phase reflow solder process.Mono-color type.Pb-free.The product itself will remain within ROHS complaintVersionApplicationAutomotive: backlighting in dashboard and switc...
17-215UYC/S530-XX/TR8: Features: Package in 8mm tape on 7diameter reel.Compatible with automatic placement equipment.Compatible with infrared and vapor phase reflow solder process.Mono-color type.Pb-free.The product itsel...
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Parameter |
Symbol |
Rating |
Unit |
Reverse Voltage |
VR |
5 |
V |
Forward Current |
IF |
25 |
mA |
Operating Temperature |
Topr |
-40~ +85 |
|
Storage Temperature |
Tstg |
-40~ +90 |
|
Electrostatic Discharge(HBM) |
ESD |
2000 |
V |
Power Dissipation |
Pd |
60 |
mW |
Peak Forward Current (Duty 1/10 @1KHz) |
IFP |
60 |
mA |
Soldering Temperature |
Tsol |
Reflow Soldering : 260 for 10 sec. Hand Soldering : 350 for 3 sec. |
The 17-215UYC/S530-XX/TR8 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
Besides, lightweight makes 17-215UYC/S530-XX/TR8 ideal for miniature applications. etc.