1608FF

The 1608FF is designed as one kind of subminiature surface mount fuses,features of the 1608FF are:(1)catalog symbol: 1608FF;(2)voltage rating:24 VDC;(3)interrupting rating: 35 amperes;(4)physical size::EIA SOCM-1608-AC (Equivalent to 0603),0.063 x 0.032 x 0.032 in.,1.6 x 0.8 x 0.8mm;(5)time-current characteristics:carry 100% rated current, 4 hours minimum. open within 5 seconds at 250% rated current;(6)agency approvals:UL recognized, std. 248-14, file r19180, guide JDYX2 CSA component acceptance file 53787, class 1422-30.

Here are the general information about this 1608FF:(1)bussmann SMT chip fuses utilize thick and thin metal film technologies for superior fusing action and enhanced reliability.;(2)The fuse element is bonded to a ceramic substrate and encapsulated with glass, providing excellent short-circuit performance and environmental integrity. Predicted reliability of the 1608FF chip fuse is 30 times greater than that of the typical chip capacitor (consult Bussmann for details);(3)the end terminations are over-plated with nickel and tin-lead and the last one (4)substrate and coating thermal expansion coefficients are closely matched to that of FR-4 epoxy-glass circuit board for superior solder joint reliability.

The most important one is the absolute maximum ratings of 1608FF:(1)operating temperature range:-65 to +125°C, with proper derating;(2)thermal shock:MIL-STD-202, Method 107, Test Condition B (-65 to 125°C), 1000 cycles, fuses soldered to FR-4 glass -epoxy circuit board;(3)vibration:MIL-STD-202, Method 204, Test Condition C (55 to 2000 HZ, 10G);(4)solderability:withstands 60 seconds above 200°C, 260°C maximum;(5)moisture resistance:MIL-STD-202, Method 106, 10 day cycle;(6)solder leach resistance & terminal adhesion:EIA-576 (30 seconds submersion in 260°C tin-lead solder).