Features: `Package in 8mm tape on 7diameter reel.`Compatible with automatic placement equipment.`Compatible with infrared and vapor phase reflow solder process.`Multi-color type.`Pb-free.`The product itself will remain within RoHS compliant version.Application·Telecommunication: indicator and back...
15-22SURSYGC/S530-E2: Features: `Package in 8mm tape on 7diameter reel.`Compatible with automatic placement equipment.`Compatible with infrared and vapor phase reflow solder process.`Multi-color type.`Pb-free.`The produc...
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`Package in 8mm tape on 7diameter reel.
`Compatible with automatic placement equipment.
`Compatible with infrared and vapor phase reflow solder process.
`Multi-color type.
`Pb-free.
`The product itself will remain within RoHS compliant version.
Parameter |
Symbol |
Rating |
Unit |
Reverse Voltage |
VR |
5 |
V |
Forward Current |
IF |
SUR:25 SYG:25 |
mA |
Peak Forward Current (Duty 1/10 @1KHz) |
IFP |
SUR:60 SYG:60 |
mA |
Power Dissipation |
Pd |
SUR:60 SYG:60 |
mW |
Electrostatic Discharge(HBM) |
ESD |
2000 |
V |
Operating Temperature |
Topr |
-40 ~ +85 |
|
Storage Temperature |
Tstg |
-40 ~ +90 |
|
Soldering Temperature |
Tsol |
Reflow Soldering : 260 for 10 sec. |
·The 15-22SURSYGC/S530-E2 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
·Besides, lightweight of the 15-22SURSYGC/S530-E2 makes them ideal for miniature applications. etc.