14TX0614

Features: ·Integrated Mixer, LO Buffer and Output Amplifier·8 dB Conversion Gain·15 dB Image Rejection·+17 dBm OIP3·+6 dBm LO Drive Level·-12 dBm LO Leakage Power·100% On-Wafer RF and DC Testing·100% Visual Inspection to MIL-STD-883 Method 2010Specifications Supply Voltage (Vd) +6.0 VDC S...

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SeekIC No. : 004209736 Detail

14TX0614: Features: ·Integrated Mixer, LO Buffer and Output Amplifier·8 dB Conversion Gain·15 dB Image Rejection·+17 dBm OIP3·+6 dBm LO Drive Level·-12 dBm LO Leakage Power·100% On-Wafer RF and DC Testing·100...

floor Price/Ceiling Price

Part Number:
14TX0614
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/17

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Product Details

Description



Features:

·Integrated Mixer, LO Buffer and Output Amplifier
·8 dB Conversion Gain
·15 dB Image Rejection
·+17 dBm OIP3
·+6 dBm LO Drive Level
·-12 dBm LO Leakage Power
·100% On-Wafer RF and DC Testing
·100% Visual Inspection to MIL-STD-883 Method 2010



Specifications

Supply Voltage (Vd) +6.0 VDC
Supply Current (Id1,2,3) 250,150,250 mA
Gate Bias Voltage (Vg) +0.3 VDC
Input Power (IF Pin) 0.0 dBm
Storage Temperature (Tstg) -65 to +165 OC
Operating Temperature (Ta) -55 to MTTF Table1
Channel Temperature (Tch) MTTF Table1
(1) Channel temperature affects a device's MTTF. It is recommended to keep channel temperature as low
     as possible for maximum life.


Description

Mimix Broadband's 10.0-18.0 GHz GaAs MMIC transmitter 14TX0614 provides +17 dBm output third order intercept and 15 dB image rejection across the band. 14TX0614 is an image reject, balanced mixer followed by a two stage output amplifier. The image reject mixer reduces the need for unwanted sideband filtering before the power amplifier. I and Q mixer inputs are provided and an external 90 degree hybrid is required to select the desired sideband. 14TX0614 uses Mimix Broadband's 0.15 µm GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. 14TX0614 is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.




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