14OSC0501

Features: On-Chip Prescaler+6.0 dBm Output Power-88 dBc/Hz @ 100KHz Phase Noise-40 dBc Harmonic Suppression110mA @ 4.0V Bias Supply100% On-Wafer, DC and Output Power Testing100% Visual Inspection to MIL-STD-883 Method 2010Specifications Supply Voltage (Vcc1,2,3) +5.0 VDC Supply Voltage (V...

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SeekIC No. : 004209733 Detail

14OSC0501: Features: On-Chip Prescaler+6.0 dBm Output Power-88 dBc/Hz @ 100KHz Phase Noise-40 dBc Harmonic Suppression110mA @ 4.0V Bias Supply100% On-Wafer, DC and Output Power Testing100% Visual Inspection to...

floor Price/Ceiling Price

Part Number:
14OSC0501
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

On-Chip Prescaler
+6.0 dBm Output Power
-88 dBc/Hz @ 100KHz Phase Noise
-40 dBc Harmonic Suppression
110mA @ 4.0V Bias Supply
100% On-Wafer, DC and Output Power Testing
100% Visual Inspection to MIL-STD-883 Method 2010



Specifications

Supply Voltage (Vcc1,2,3) +5.0 VDC
Supply Voltage (Vtune) +7.0 VDC
Supply Current (Icc1,2,3) 150 mA
Supply Current (Itune) 1 mA
Storage Temperature (Tstg) -65 to +165
Operating Temperature (Ta) 55 to MTTF Table1
Junction Temperature (Tjn) MTTF Table1

(1) Junction temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life.




Description

Mimix Broadband's 14.2-15.2 GHz GaAs HBT VCO 14OSC0501 is a fully integrated oscillator MMIC with on-chip frequency doubler and divide-by-8 prescaler (w.r.t RFout). This design is based on a cross coupled differential pair with on-chip tuning diode and resonator. The use of a high-Q resonator structure and integrated varactor diodes results in optimum phase-noise performance, whilst the integration of frequency doubler and prescaler reduce application complexity and time-to-market.

The 14OSC0501 uses Mimix Broadband's 2 um GaAs HBT device model technology to ensure low flicker (1/f ) noise and high reliability. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.




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