High Speed / Modular Connectors Z-PACK HS3 HDR 60P
120674-2: High Speed / Modular Connectors Z-PACK HS3 HDR 60P
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Multilayer Ceramic Capacitors (MLCC) - SMD/SMT R 630-CL31C151JBNC CER CHIP 50V NPO 150
Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 50V 22PF 1206 SUB 630-CL31C220JBNC
Series : | 120674 | Number of Rows : | 6 |
Number of Positions / Contacts : | 60 | Pitch : | 2 mm |
Mounting Style : | Through Hole | Termination Style : | Solder Pin |
Housing Material : | Glass Filled Polyester | Contact Material : | Phosphor Bronze |
Contact Plating : | Gold over Nickel |
Technical/Catalog Information | 120674-2 |
Vendor | Tyco Electronics |
Category | Connectors |
Color | - |
Connector Style | Dual Beam, Center |
Connector Type | Header, Male Pins, Shrouded |
Connector Usage | Backplane |
Contact Finish | Gold |
Contact Finish Thickness | 30in (0.76m) |
Contact Layout, Typical | - |
Features | - |
Mounting Type | Through Hole |
Number of Columns | 10 |
Number of Positions | 60 |
Number of Rows | 6 |
Pitch | 0.098" (2.50mm) |
Termination | Press-Fit |
Number of Contacts Loaded | All |
Packaging | Tube |
Lead Free Status | Contains Lead |
RoHS Status | RoHS Compliant by Exemption |
Other Names | 120674 2 1206742 |