Features: `Package in 8mm tape on 7diameter reel.`Compatible with automatic placement equipment.`Compatible with infrared and vapor phase reflow solder process.`Mono-color type.`Pb-free.`The product itself will remain within RoHS compliant version.Application·Backlighting in dashboard and switch.·...
12-215/R8C-AN1P2B/3C: Features: `Package in 8mm tape on 7diameter reel.`Compatible with automatic placement equipment.`Compatible with infrared and vapor phase reflow solder process.`Mono-color type.`Pb-free.`The product...
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Parameter | Symbol | Rating | Unit |
Forward Current | IF | 25 | mA |
Peak Forward Current (Duty 1/10 @1KHz) |
IFP | 60 | mA |
Operating Temperature | Topr | -40 to +85 | |
Storage Temperature | Tstg | -40 to +90 | |
Soldering Temperature | Tsol | Reflow Soldering : 260 for 10 sec. Hand Soldering : 350 for 3 sec. | |
Electrostatic Discharge(HBM) | ESD | 2000 | V |
Power Dissipation | Pd | 60 | mW |
Reverse Voltage | VR | 5 |
·The 12-215/R8C-AN1P2B/3C SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
·Besides, lightweight makes them ideal for miniature applications. etc.