THERMAL PAD TO-220 .009" SP1000
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Series: | Sil-Pad® 1000 | Manufacturer: | Bergquist | ||
Usage: | TO-220 | Shape: | Rectangular | ||
Outline: | 19.05mm x 12.70mm | Thickness: | 0.009" (0.229mm) | ||
Material: | Silicone Based | Propagation Delay Time : | 13.5 ns | ||
Adhesive: | - | Backing, Carrier: | Fiberglass | ||
Color: | Pink | Thermal Resistivity: | 0.35°C/W |
Technical/Catalog Information | 1009-58 |
Vendor | Bergquist |
Category | Thermal Management |
Usage | TO-220 |
Shape | Rectangular |
Material | Silicone/Fiberglass |
Thermal Conductivity | 1.2 W/m-K |
Thermal Resistivity | 0.35°C/W |
Thickness | 0.009" (0.229mm) |
Outline | 19.05mm x 12.70mm |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | 1009 58 100958 BER199 ND BER199ND BER199 |