DescriptionThe 038812MXEP is designed as one kind of lead-free 3AG, METI B fuse device that solves a broad range of application requirements while offering reliable performance and cost-effective circuit protection. Also 038812MXEP can be used as supplementary protection in appliance or utilizatio...
038812MXEP: DescriptionThe 038812MXEP is designed as one kind of lead-free 3AG, METI B fuse device that solves a broad range of application requirements while offering reliable performance and cost-effective ci...
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The 038812MXEP is designed as one kind of lead-free 3AG, METI B fuse device that solves a broad range of application requirements while offering reliable performance and cost-effective circuit protection. Also 038812MXEP can be used as supplementary protection in appliance or utilization equipment to provide individual protection for components or internal circuits. Features of the 038812MXEP are:(1) RoHS compliant and Lead-free;(2)designed to Japanese standard JIS C6575;(3)available in cartridge and axial lead form and various forming demensions.
The recommended process parameters of the 038812MXEP can be summarized as:(1)Temperature Minimum: 100°C;(2)Temperature Maximum: 150°C;(3)Preheat Time: 60-180 seconds;(4)Solder Pot Temperature: 260°C Maximum;(5)Solder Dwell Time: 2-5 seconds.
The product characteristics of 038812MXEP can be summarized as:(1)Materials: Body is Glass and End Caps is Nickelplated brass;(2)Operating Temperature: -55ºC to +125ºC (consider de-rating);(3)Thermal Shock: MIL-STD-202G Method 107 G, Test conditon B:(5 cycles - 65ºC to 125ºC);(4)Vibration: MIL-STD-202G, Method 201A;(5)Salt Spray: MIL-STD-202G, Method 101D, Test Condition B;(6)Solderability: Reference IEC 60127 Second Edition 2003-2001 Annex A. If you want to know more information about the 038812MXEP, please download the datasheet in www.seekic.com or www.chinaicmart.com .