Spansion Develops Single-level Cell NAND with New Feature

Published:2012/5/25 4:16:00 Author:Li xiao na From:SeekIC

In order to emerge from a deal with Hynix Inc, Flash memory vendor Spansion Inc begin sampling the first single-level cell NAND flash memory devices. These devices are implemented in 4X-nm floating-gate technology, which are designed to be used in automotive, consumer and networking applications.

Spansion SLC NAND will be offered in densities from 1 Gb to 8 Gb in 3.0V and 1.8V families that feature high performance, extended temperature range, long-term product support and stringent reliability demands. Different from commodity NAND, which producers can stop building as soon as the next generation is available, NAND devices aim to the embedded market require a longer lifespan. Customers of embedded products need the vendors to produce in volume. What is more, the embedded market also requires the better performance and durability of SLC NAND. Spansion’s NAND products will compliment the firm’s flagship NOR flash products for the embedded market and meet the customer’s need.

According to the report from iSuppli, introduction of Spansion’s SLC NAND products is a positive development for the embedded market. Cooperating with SK Hynix, Spansion is able to continue developing its charge-trapping NAND technology. Spansion is sampling 3-volt 1 Gb, 2 Gb, and 4 Gb monolithic SLC NAND devices now. Its SLC NAND devices can offer 100,000 cycle endurance and withstand an industrial temperature range of -40C to +85C.

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