Published:2012/2/15 20:48:00 Author:Phyllis From:SeekIC
NXP Semiconductor’s recent announced LPC1100LV series is the world’s first ARM® Cortex™-M0 microcontroller that designed specifically for battery-powered end applications. With dual supply voltage of 1.65V to 1.95V VDD and 1.65V to 3.6V VIO, the LPC1100LV series offers 50 MIPS performance in a tiny 2-mm x 2-mm footprint with over three times power reduction compared to similar 3.3V VDD devices.
The LPC1100LV can handle linear current consumption at low clock frequency while reducing system power because of NXP’s latest proprietary embedded Flash with 256-Byte erase sector and low leakage current. The LPC1100LV devices deliver 50 MIPS of performance compared to the 1 to 5 MIPS performance typical of 8/16-bit MCUs. This high performance allows LPC1100LV to complete demanding tasks faster and to remain in active mode for a shorter period of time, further reducing the average current consumed by the device.
Given the same task, LPC1100LV’s unique 1.65V-1.95V VDD low-voltage input offers more than three times power reduction compared to competitor Cortex-M0 devices using 3.3V VDD input, and more than ten times compared to typical 8/16-bit MCUs. Sub-systems that can take special advantage of the LPC1100LV’s MIPS performance include system security and authentication, system interface and controls, system peripheral controls, and for running software stacks.
As the world’s smallest 32-bit MCUs, the LPC1100LV is available in NXP’s tiny 2-mm x 2-mm Chip-Scale Package (WLCSP). It is also available in a 5-mm x 5-mm HVQFN package and offering 1.8V VDD and 3.3V VIO dual voltage inputs for CPU and I/O, this option offers a unique level-shifting capability between SSP/SPI (3.3V) and I2C (1.8V). NXP is also offering customized combinations of SRAM, Flash and package for high-volume customers.
About NXP Semiconductors:
NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications.
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