TSMC tries to develop its 3-D chip stacking technology all alone

Published:2011/12/13 21:18:00 Author:Phyllis From:SeekIC

As the progress is becoming more difficult in the traditional scaling of semiconductor process technology, 3-D chip stacks have been regarded as a strategic new direction in chip design.

Recently, TSMC announced that the company will try to go it alone with an integrated 3-D chip stacking technology. The approach makes commercial sense for TSMC, but some fabless chip designers said it lacks technical merit and limits their options.

According to TSMC, its approach will be simpler, cheaper and more reliable than using multiple foundries, packaging houses and other partners. Early on in the process, the main focus would on creating through-silicon vias, then on adding packaging capabilities to fabs.

TSMC made 3-D test chips for about five companies. Xilinx was one of them, which used Amkor as a packaging partner. These first 3-D customers will be able to continue using external partnerships if they choose, but for new customers, the company will have one integrated solution.

Using a single foundry can reduce shipping that can crack the thin wafers needed for 3-D ICs and reduces confusion of who is liable for a broken product. TSMC also believes it can lower costs by eliminating unneeded steps at lower capital equipment costs than packaging houses.

As the reliability issues had become much worse, more risky and complicated, coming forward to assume the responsibility and take on the challenges is the right thing to do since this is a new ball game, and the old way of doing business is out of date.

Xilinx plans to continue using a mix of foundries and packaging houses such as TSMC and Amkor to make its so-called 2.5-D chips such as the Virtex 2000T announced earlier this year. In general, the fabless industry would like more degrees of freedom

Analysts noted TSMC will face plenty of competition and may be forced into being more of a team player. TSMC said they want to do everything. But the rest of the industry also should step up so that these processes are well adopted and understood. TSMC makes a very compelling case but others won’t lie down or go away.

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