Fujipoly Develops Sarcon GR-SL

Published:2011/8/29 6:15:00 Author:Amy From:SeekIC

Fujipoly, a wholly owned subsidiary of Fuji Polymer Industries Co., Ltd., recently has developed Sarcon GR-SL with an extremely low compression and high-performance thermal gap filler material. When placed on top of uneven components, this material quickly conforms to all gaps, peeks and air pockets making a level, large surface area contact point. The high degree of physical contact enables the heatsink to more efficiently eliminate undesired heat.


The worldwide desire for advanced technology is increasing at a record pace. In order to stay ahead of this demand curve, electronics manufacturers are looking for new opportunities to integrate emerging technologies on the same board. Today, it is common practice to incorporate multi-band communications, GPS, video and high-speed processors within a very small device footprint.


As Fujipoly’s softest gap filler pad, this unique formulation provides a thermal conductivity of 2.7 W/m°K with a thermal resistance between 0.94 and 1.69 °Cin2/W depending on sheet thickness. The V-0 tested Sarcon GR-SL in 2.5 or 5.0mm thick is available and sheets up to a maximum 200x300mm dimension with an operating temperature of -40 to +150°C.

Reprinted Url Of This Article: http://www.seekic.com/blog/IndustryNews/2011/08/29/Fujipoly_Develops_Sarcon_GR_SL.html

Print this Page | Comments | Reading(359)