Published:2010/12/8 21:10:00 Author:Li xiao na From:SeekIC
The intelligent electric device has driven the fusion of chip component Practitioner. Although the size of the smart phone and tablet computer is very small, they have so many functions. The high integrated circuit is built in these devices. In order to overcome the limitation of the space and function, customers need the chip which is smaller and multifunctional. The InnoChips Technology has developed the multiple EMI Filters which combines the EMI Filter and antistatic functions together.
An ordinary cell phone has ten varistors generally, but the quantity of the chip can be reduced if the multiple EMI Filters are used. Company in Japan is also developing this technique, but the InnoChips Technology in Korea has published in advance. These products have gained the good marks from the manufacturers of smart phone and tablet computer. In order to implement the fusion of the frequent controlling component practitioner, they are also developing the new materials and technique. There are five to six kinds of antennas are built in the smart phone, such as the GMB, Bluetooth, GPS and RF. The long-term evolution technology and near field communication are also added to the phone, so the quantity of the frequency controlling component will be thirteen in the future.
An antenna always has one frequency, which will take so much space of the smart phone. The customers hope to develop the dual-frequency or triple-band products. The manufacturers in South Korea are going to apply the material to develop the dual-frequency or triple-band network card. What is more, the practitioners in South Korea have released the products which integrate the touch screen driving chip and Haptic driver. The motor of Haptic can startup when people touch the screen with finger. The manufacturers of the intelligent device are more likely to choose the products with high-performance. The products, which are able to improve the efficiency of the device, will be welcomed by them. The related integrated circuit is A104SN03.
Reprinted Url Of This Article: http://www.seekic.com/blog/IndustryNews/2010/12/08/New_Techniques_Drive_The_Fusion_Of_Chip_Component_Practitioner.html
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